Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
Joint Authors
Lee, Chun-Ying
Cheng, Kuan-Hui
Chen, Fu-Je
Lin, Chao-Sung
Huang, Jung-Tang
Lan, Chang-Cheng
Tsou, Ping-Huan
Ho, Tzu-I
Source
Advances in Materials Science and Engineering
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-04-14
Country of Publication
Egypt
No. of Pages
6
Abstract EN
Due to its widely tunable mechanical property and incompatibility with most solders, Ni-Mn alloy can become a viable candidate in the fabrication of testing probe for microelectronic devices.
In this study, the electrodeposition of Ni-Mn alloy in nickel sulphamate electrolyte with the addition of manganese sulphate was investigated under direct current (DC) power source.
The effects of current density and Mn2+ concentration in the electrolyte on the coating composition, cathodic efficiency, microstructure and mechanical properties were explored.
The results showed that the raise of the Mn2+ concentration in the electrolyte alone did not effectively increase the Mn content in the coating but reduce the cathodic efficiency.
On the other hand, increasing the current density facilitated the codeposition of the Mn and rendered the crystallite from coarse columnar grain to the refined one.
Thus, both hardness and internal stress of the coating increased.
The fabrication of testing probes at 1 A/dm2 was shown to satisfy the high hardness, low internal stress, reasonable fatigue life, and nonsticking requirements for this microelectronic application.
American Psychological Association (APA)
Cheng, Kuan-Hui& Chen, Fu-Je& Lee, Chun-Ying& Lin, Chao-Sung& Huang, Jung-Tang& Lan, Chang-Cheng…[et al.]. 2014. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1034321
Modern Language Association (MLA)
Cheng, Kuan-Hui…[et al.]. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-6.
https://search.emarefa.net/detail/BIM-1034321
American Medical Association (AMA)
Cheng, Kuan-Hui& Chen, Fu-Je& Lee, Chun-Ying& Lin, Chao-Sung& Huang, Jung-Tang& Lan, Chang-Cheng…[et al.]. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1034321
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1034321