Impact of Bundle Structure on Performance of on-Chip CNT Interconnects
Joint Authors
Source
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-06-05
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
CNTs are proposed as a promising candidate against copper in deep submicron IC interconnects.
Still this technology is in its infancy.
Most available literatures on performance predictions of CNT interconnects, have focused only on interconnect geometries using segregated CNTs.
Yet during the manufacturing phase, CNTs are obtained usually as a mixture of single-walled and multi-walled CNTs (SWCNTs and MWCNTs).
Especially in case of SWCNTs; it is usually available as a mixture of both Semi conducting CNTs and metallic CNTs.
This paper attempts to answer whether segregation is inevitable before using them to construct interconnects.
This paper attempt to compare the performance variations of bundled CNT interconnects, where bundles are made of segregated CNTs versus mixed CNTs, for future technology nodes using electrical model based analysis.
Also a proportionate mixing of different CNTs has been introduced so as to yield a set of criteria to aid the industry in selection of an appropriate bundle structure for use in a specific application with optimum performance.
It was found that even the worst case performance of geometries using a mixture of SWCNTs and MWCNTs was better than copper.
These results also reveal that, for extracting optimum performance vide cost matrix, the focus should be more on diameter controlled synthesis than on segregation.
American Psychological Association (APA)
Kuruvilla, Nisha& Raina, J. P.. 2014. Impact of Bundle Structure on Performance of on-Chip CNT Interconnects. Journal of Nanotechnology،Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1042187
Modern Language Association (MLA)
Kuruvilla, Nisha& Raina, J. P.. Impact of Bundle Structure on Performance of on-Chip CNT Interconnects. Journal of Nanotechnology No. 2014 (2014), pp.1-8.
https://search.emarefa.net/detail/BIM-1042187
American Medical Association (AMA)
Kuruvilla, Nisha& Raina, J. P.. Impact of Bundle Structure on Performance of on-Chip CNT Interconnects. Journal of Nanotechnology. 2014. Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1042187
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1042187