Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-InCu Interfaces
Joint Authors
Pstruś, Janusz
Gancarz, Tomasz
Fima, Przemyslaw
Source
Advances in Materials Science and Engineering
Issue
Vol. 2017, Issue 2017 (31 Dec. 2017), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2017-10-01
Country of Publication
Egypt
No. of Pages
8
Abstract EN
The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min.
Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion.
Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated.
The ε-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between ε-CuZn4 and the Cu substrate.
With increasing wetting time, the thickness of ε-CuZn4 increases, while the thickness of ε-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.
American Psychological Association (APA)
Pstruś, Janusz& Gancarz, Tomasz& Fima, Przemyslaw. 2017. Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-InCu Interfaces. Advances in Materials Science and Engineering،Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1125139
Modern Language Association (MLA)
Pstruś, Janusz…[et al.]. Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-InCu Interfaces. Advances in Materials Science and Engineering No. 2017 (2017), pp.1-8.
https://search.emarefa.net/detail/BIM-1125139
American Medical Association (AMA)
Pstruś, Janusz& Gancarz, Tomasz& Fima, Przemyslaw. Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-InCu Interfaces. Advances in Materials Science and Engineering. 2017. Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1125139
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1125139