Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation
Joint Authors
Oh, Hyun-Ung
Jung, Sung-Hoon
Park, Tae-Yong
Jeon, Su-Hyeon
Kim, Su-Jeong
Source
International Journal of Aerospace Engineering
Issue
Vol. 2018, Issue 2018 (31 Dec. 2018), pp.1-12, 12 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2018-10-08
Country of Publication
Egypt
No. of Pages
12
Abstract EN
Thermal gap pads are widely used for effective heat transfer from high-heat-dissipating components to a heat sink.
The initial contact pressure of thermal pads is an important parameter for enhancing the heat transfer capability of thermal design during the assembly process of the heat sink.
However, this causes stress on the solder joint of the component as a result of the pad’s inherent resistance to deformation.
In this study, we investigated the effect of thermal pad on the fatigue life of the solder joint of CCGA 624 package for space usage.
A random vibration fatigue test for several specimen assembly sets with various pressurization levels of thermal gap pads was performed, and their fatigue lives were compared with that of the package without the initial pressure of thermal gap pads.
American Psychological Association (APA)
Park, Tae-Yong& Jeon, Su-Hyeon& Kim, Su-Jeong& Jung, Sung-Hoon& Oh, Hyun-Ung. 2018. Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation. International Journal of Aerospace Engineering،Vol. 2018, no. 2018, pp.1-12.
https://search.emarefa.net/detail/BIM-1166926
Modern Language Association (MLA)
Park, Tae-Yong…[et al.]. Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation. International Journal of Aerospace Engineering No. 2018 (2018), pp.1-12.
https://search.emarefa.net/detail/BIM-1166926
American Medical Association (AMA)
Park, Tae-Yong& Jeon, Su-Hyeon& Kim, Su-Jeong& Jung, Sung-Hoon& Oh, Hyun-Ung. Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation. International Journal of Aerospace Engineering. 2018. Vol. 2018, no. 2018, pp.1-12.
https://search.emarefa.net/detail/BIM-1166926
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1166926
