Nanowires of Lead-Free Solder Alloy SnCuAg
Joint Authors
Atalay, S.
Avsar, D.
Atalay, F. E.
Seckin, T.
Yagmur, V.
Kaya, H.
Source
Issue
Vol. 2011, Issue 2011 (31 Dec. 2011), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2011-05-17
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Engineering Sciences and Information Technology
Chemistry
Civil Engineering
Abstract EN
Ternary Sn88Ag5Cu7, Sn93Ag4Cu3, Sn58Ag18Cu24, Sn78Ag16Cu6, Sn90Ag4Cu6, Sn87Ag4Cu9 alloy nanowires were produced at various values of deposition potential by dc electrodeposition on highly ordered porous anodic alumina oxide (AAO) templates.
During the deposition process some parameters, such as ion content, deposition time, pH, and temperature of the solution, were kept constant.
The diameter and length of regular Sn93Ag4Cu3 nanowires electrodeposited at −1 V were determined by scanning electron microscopy (SEM) to be approximately 200–250 nm and 7-8 μm, respectively.
Differential scanning calorimetry (DSC) results indicate that the melting onset temperature of Sn93Ag4Cu3 nanowires is about 204°C.
American Psychological Association (APA)
Atalay, F. E.& Avsar, D.& Kaya, H.& Yagmur, V.& Atalay, S.& Seckin, T.. 2011. Nanowires of Lead-Free Solder Alloy SnCuAg. Journal of Nanomaterials،Vol. 2011, no. 2011, pp.1-6.
https://search.emarefa.net/detail/BIM-508173
Modern Language Association (MLA)
Atalay, F. E.…[et al.]. Nanowires of Lead-Free Solder Alloy SnCuAg. Journal of Nanomaterials No. 2011 (2011), pp.1-6.
https://search.emarefa.net/detail/BIM-508173
American Medical Association (AMA)
Atalay, F. E.& Avsar, D.& Kaya, H.& Yagmur, V.& Atalay, S.& Seckin, T.. Nanowires of Lead-Free Solder Alloy SnCuAg. Journal of Nanomaterials. 2011. Vol. 2011, no. 2011, pp.1-6.
https://search.emarefa.net/detail/BIM-508173
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-508173
