Creep behavior of β Cu-Zn alloys

Abstract EN

Transient creep tests are performed under constant stress conditions at temperatures ranging from 533 to 653˚ K for Cu-38wt%Zn, and Cu-38wt%Zn-2wt% Pb samples.

The transient creep is described by ξtr= β tn, where ξtr and t are the transient creep strain and time respectively.

However, the parameters n, β are calculated, and the activation energy of the transient creep shows two regions for both alloys at low and high temperatures.

Also, the activation energy was determined to clarify the controlling mechanism.

At low temperature rang (513-633˚k), the strain rate sensitivity parameter m has values (0.247-0.174) while its values at high temperatures ranging from (0.192 up to 0.263) at 653˚K.

These values give an indication that dislocation glide is probably an operating mechanism in grain boundary diffusion.

Also, the change of microstructure grain size, microhardness, and stress-strain behavior have been studied