Directional Solidification of Sn-Cu6Sn5 In Situ Composites
المؤلف
المصدر
Advances in Materials Science and Engineering
العدد
المجلد 2019، العدد 2019 (31 ديسمبر/كانون الأول 2019)، ص ص. 1-8، 8ص.
الناشر
Hindawi Publishing Corporation
تاريخ النشر
2019-03-13
دولة النشر
مصر
عدد الصفحات
8
الملخص EN
The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family of alloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth of the different phases.
Sn-Cu system has two intermetallic phases, i.e., ε-Cu3Sn and η-Cu6Sn5, and η can be used as the negative (anode) electrode in Li-ion batteries, alone or as part of (Co,Ni)xCu6−xSn5-type composites.
Obtaining this η phase from liquid with the appropriate chemical composition is a very difficult task because it has a formation temperature lower than liquidus for such a composition.
In this way, the η phase appears as a consequence of a solid-solid transformation from the ε phase However, it is possible to find the η phase as the primary or secondary phase after a eutectic reaction for lower concentrations of Cu.
On the other side, the Cu6Sn5 phase shows a hexagonal to monoclinic solid-solid transformation around 187°C, which could affect the mechanical system stability when it is used as solder.
In this work, directional solidification at different growth velocities of hypereutectic Sn-Cu samples was performed.
The resultant microstructure varies with the growth velocity, but it is formed for a fibber-like primary phase Cu6Sn5 which is projected towards the liquid phase.
Behind this region, these fibbers are rounded by a two-phase Sn-Cu6Sn5 structure.
In this way, three zones could to be defined in the sample during the directional growth: (i) an entirely solid two-phase region, formed by η rounded by β(Sn) + η eutectic-like structure, (ii) a two-phase solid (η) + liquid, and (iii) the remnant liquid in front of the interface.
نمط استشهاد جمعية علماء النفس الأمريكية (APA)
Fornaro, Osvaldo. 2019. Directional Solidification of Sn-Cu6Sn5 In Situ Composites. Advances in Materials Science and Engineering،Vol. 2019, no. 2019, pp.1-8.
https://search.emarefa.net/detail/BIM-1121265
نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)
Fornaro, Osvaldo. Directional Solidification of Sn-Cu6Sn5 In Situ Composites. Advances in Materials Science and Engineering No. 2019 (2019), pp.1-8.
https://search.emarefa.net/detail/BIM-1121265
نمط استشهاد الجمعية الطبية الأمريكية (AMA)
Fornaro, Osvaldo. Directional Solidification of Sn-Cu6Sn5 In Situ Composites. Advances in Materials Science and Engineering. 2019. Vol. 2019, no. 2019, pp.1-8.
https://search.emarefa.net/detail/BIM-1121265
نوع البيانات
مقالات
لغة النص
الإنجليزية
الملاحظات
Includes bibliographical references
رقم السجل
BIM-1121265
قاعدة معامل التأثير والاستشهادات المرجعية العربي "ارسيف Arcif"
أضخم قاعدة بيانات عربية للاستشهادات المرجعية للمجلات العلمية المحكمة الصادرة في العالم العربي
تقوم هذه الخدمة بالتحقق من التشابه أو الانتحال في الأبحاث والمقالات العلمية والأطروحات الجامعية والكتب والأبحاث باللغة العربية، وتحديد درجة التشابه أو أصالة الأعمال البحثية وحماية ملكيتها الفكرية. تعرف اكثر