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Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition
المؤلفون المشاركون
Ibehej, Tomáš
Hromádka, Jakub
Hrach, Rudolf
المصدر
Advances in Materials Science and Engineering
العدد
المجلد 2017، العدد 2017 (31 ديسمبر/كانون الأول 2017)، ص ص. 1-7، 7ص.
الناشر
Hindawi Publishing Corporation
تاريخ النشر
2017-10-18
دولة النشر
مصر
عدد الصفحات
7
الملخص EN
We present a computational study of processes taking place in a sheath region formed near a negatively biased uneven substrate during ionized plasma vapour deposition.
The sputtered metal atoms are ionized on their way to substrate and they are accelerated in the sheath near the substrate.
They are able to penetrate to high-aspect-ratio structures, for example, trenches, which can be, therefore, effectively coated.
The main technique used was a two-dimensional particle simulation.
The results of our model predict the energy and angular distributions of impinging ions in low-pressure conditions which are characteristic for this method and where typical continuous models fail due to unfulfilled assumptions.
Input bulk plasma properties were computed by a “zero dimensional” global model which took into account more physical processes important on a scale of the whole magnetron chamber.
Output parameters, such as electrostatic potential, energy of ions, and ion fluxes, were computed for wide range of conditions (electron density and substrate bias) to show the influence of these conditions on observed phenomena, penetration of sheath inside the trench, deceleration of argon and copper ions inside the trench, and local maxima of ion fluxes near the trench opening.
نمط استشهاد جمعية علماء النفس الأمريكية (APA)
Ibehej, Tomáš& Hromádka, Jakub& Hrach, Rudolf. 2017. Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition. Advances in Materials Science and Engineering،Vol. 2017, no. 2017, pp.1-7.
https://search.emarefa.net/detail/BIM-1124050
نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)
Ibehej, Tomáš…[et al.]. Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition. Advances in Materials Science and Engineering No. 2017 (2017), pp.1-7.
https://search.emarefa.net/detail/BIM-1124050
نمط استشهاد الجمعية الطبية الأمريكية (AMA)
Ibehej, Tomáš& Hromádka, Jakub& Hrach, Rudolf. Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition. Advances in Materials Science and Engineering. 2017. Vol. 2017, no. 2017, pp.1-7.
https://search.emarefa.net/detail/BIM-1124050
نوع البيانات
مقالات
لغة النص
الإنجليزية
الملاحظات
Includes bibliographical references
رقم السجل
BIM-1124050
قاعدة معامل التأثير والاستشهادات المرجعية العربي "ارسيف Arcif"
أضخم قاعدة بيانات عربية للاستشهادات المرجعية للمجلات العلمية المحكمة الصادرة في العالم العربي
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