Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design
المؤلفون المشاركون
John Famoriji, Oluwole
Yan, Xu
Khan, Mehdi
Kashif, Rao
Fadamiro, Akinwale
Ali, Md Sadek
Lin, Fujiang
المصدر
Wireless Communications and Mobile Computing
العدد
المجلد 2017، العدد 2017 (31 ديسمبر/كانون الأول 2017)، ص ص. 1-8، 8ص.
الناشر
Hindawi Publishing Corporation
تاريخ النشر
2017-12-05
دولة النشر
مصر
عدد الصفحات
8
التخصصات الرئيسية
تكنولوجيا المعلومات وعلم الحاسوب
الملخص EN
Wireless chip area network which enables wireless communication among chips fosters development in wireless communication and it is envisioned that future hardware system and developmental functionality will require multimaterial.
However, the traditional system architecture is limited by channel bandwidth-limited interfaces, throughput, delay, and power consumption and as a result limits the efficiency and system performance.
Wireless interconnect has been proposed to overcome scalability and performance limitations of multihop wired architectures.
Characterization and modeling of channel become more important for specification of choice of modulation or demodulation techniques, channel bandwidths, and other mitigation techniques for channel distortion and interference such as equalization.
This paper presents an analytical channel model for characterization, modeling, and analysis of wireless chip-to-chip or interchip interconnects in wireless chip area network with a particular focus on large-scale analysis.
The proposed model accounts for both static and dynamic channel losses/attenuation in high-speed systems.
Simulation and evaluation of the model with experimental data conducted in a computer desktop casing depict that proposed model matched measurement data very closely.
The transmission of EM waves via a medium introduces molecular absorption due to various molecules within the material substance.
This model is a representative of channel loss profile in wireless chip-area-network communication and good for future electronic circuits and high-speed systems design.
نمط استشهاد جمعية علماء النفس الأمريكية (APA)
John Famoriji, Oluwole& Yan, Xu& Khan, Mehdi& Kashif, Rao& Fadamiro, Akinwale& Ali, Md Sadek…[et al.]. 2017. Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design. Wireless Communications and Mobile Computing،Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1206009
نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)
John Famoriji, Oluwole…[et al.]. Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design. Wireless Communications and Mobile Computing No. 2017 (2017), pp.1-8.
https://search.emarefa.net/detail/BIM-1206009
نمط استشهاد الجمعية الطبية الأمريكية (AMA)
John Famoriji, Oluwole& Yan, Xu& Khan, Mehdi& Kashif, Rao& Fadamiro, Akinwale& Ali, Md Sadek…[et al.]. Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design. Wireless Communications and Mobile Computing. 2017. Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1206009
نوع البيانات
مقالات
لغة النص
الإنجليزية
الملاحظات
Includes bibliographical references
رقم السجل
BIM-1206009
قاعدة معامل التأثير والاستشهادات المرجعية العربي "ارسيف Arcif"
أضخم قاعدة بيانات عربية للاستشهادات المرجعية للمجلات العلمية المحكمة الصادرة في العالم العربي
تقوم هذه الخدمة بالتحقق من التشابه أو الانتحال في الأبحاث والمقالات العلمية والأطروحات الجامعية والكتب والأبحاث باللغة العربية، وتحديد درجة التشابه أو أصالة الأعمال البحثية وحماية ملكيتها الفكرية. تعرف اكثر