CFD study of using different heat sinks for electronic equipments cooling

الملخص EN

Cooling of Electronic equipment’s is an attractive research area in engineering applications.

Continued minimization of electronic system has resulted in dramatic increase in the amount of heat generated per unit volume, The aim of this study is to use computational Fluid Dynamics in order to draw a CFD model for forced cooling conjugate heat transfer analyses in heat generating electronic systems and compare between a collection of actual commercial heat sinks different from in geometry ,material , and number of fins .A complete computer chassis model with heat sinks and fans inside was created and parametric analyses were performed to compare the effects of different turbulence models, mesh resolutions, and radiative heat transfer.

The CFD software was used, ANSYS Icepack 18.0 for preprocessing and fluent for solution and post processing.

The road map was applied to five different heat sinks and another three heat sink as a validation modeled into the full chassis.

Numerical results were compared with the available experimental data and they were in good agreement.