Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials

المؤلفون المشاركون

Messai, Abderraouf
Amir, Mounir
Fortaki, Tarek
Benkouda, Siham
Bedra, Sami

المصدر

International Journal of Antennas and Propagation

العدد

المجلد 2013، العدد 2013 (31 ديسمبر/كانون الأول 2013)، ص ص. 1-7، 7ص.

الناشر

Hindawi Publishing Corporation

تاريخ النشر

2013-08-22

دولة النشر

مصر

عدد الصفحات

7

التخصصات الرئيسية

هندسة كهربائية

الملخص EN

A rigorous full-wave analysis of high Tc superconducting rectangular microstrip patch over ground plane with rectangular aperture in the case where the patch is printed on a uniaxially anisotropic substrate material is presented.

The dyadic Green’s functions of the considered structure are efficiently determined in the vector Fourier transform domain.

The effect of the superconductivity of the patch is taken into account using the concept of the complex resistive boundary condition.

The accuracy of the analysis is tested by comparing the computed results with measurements and previously published data for several anisotropic substrate materials.

Numerical results showing variation of the resonant frequency and the quality factor of the superconducting antenna with regard to operating temperature are given.

Finally, the effects of uniaxial anisotropy in the substrate on the resonant frequencies of different TM modes of the superconducting microstrip antenna with rectangular aperture in the ground plane are presented.

نمط استشهاد جمعية علماء النفس الأمريكية (APA)

Messai, Abderraouf& Benkouda, Siham& Amir, Mounir& Bedra, Sami& Fortaki, Tarek. 2013. Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials. International Journal of Antennas and Propagation،Vol. 2013, no. 2013, pp.1-7.
https://search.emarefa.net/detail/BIM-451454

نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)

Messai, Abderraouf…[et al.]. Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials. International Journal of Antennas and Propagation No. 2013 (2013), pp.1-7.
https://search.emarefa.net/detail/BIM-451454

نمط استشهاد الجمعية الطبية الأمريكية (AMA)

Messai, Abderraouf& Benkouda, Siham& Amir, Mounir& Bedra, Sami& Fortaki, Tarek. Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials. International Journal of Antennas and Propagation. 2013. Vol. 2013, no. 2013, pp.1-7.
https://search.emarefa.net/detail/BIM-451454

نوع البيانات

مقالات

لغة النص

الإنجليزية

الملاحظات

Includes bibliographical references

رقم السجل

BIM-451454