Chip Attach Scheduling in Semiconductor Assembly

المؤلفون المشاركون

Zhang, Zhicong
Zhao, Shaoyong
Hu, Kaishun
Huang, Huiyu
Li, Shuai

المصدر

Journal of Industrial Engineering

العدد

المجلد 2013، العدد 2013 (31 ديسمبر/كانون الأول 2013)، ص ص. 1-11، 11ص.

الناشر

Hindawi Publishing Corporation

تاريخ النشر

2013-03-26

دولة النشر

مصر

عدد الصفحات

11

التخصصات الرئيسية

العلوم الهندسية و تكنولوجيا المعلومات
علوم

الملخص EN

Chip attach is the bottleneck operation in semiconductor assembly.

Chip attach scheduling is in nature unrelated parallel machine scheduling considering practical issues, for example, machine-job qualification, sequence-dependant setup times, initial machine status, and engineering time.

The major scheduling objective is to minimize the total weighted unsatisfied Target Production Volume in the schedule horizon.

To apply Q-learning algorithm, the scheduling problem is converted into reinforcement learning problem by constructing elaborate system state representation, actions, and reward function.

We select five heuristics as actions and prove the equivalence of reward function and the scheduling objective function.

We also conduct experiments with industrial datasets to compare the Q-learning algorithm, five action heuristics, and Largest Weight First (LWF) heuristics used in industry.

Experiment results show that Q-learning is remarkably superior to the six heuristics.

Compared with LWF, Q-learning reduces three performance measures, objective function value, unsatisfied Target Production Volume index, and unsatisfied job type index, by considerable amounts of 80.92%, 52.20%, and 31.81%, respectively.

نمط استشهاد جمعية علماء النفس الأمريكية (APA)

Zhang, Zhicong& Hu, Kaishun& Li, Shuai& Huang, Huiyu& Zhao, Shaoyong. 2013. Chip Attach Scheduling in Semiconductor Assembly. Journal of Industrial Engineering،Vol. 2013, no. 2013, pp.1-11.
https://search.emarefa.net/detail/BIM-461244

نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)

Zhang, Zhicong…[et al.]. Chip Attach Scheduling in Semiconductor Assembly. Journal of Industrial Engineering No. 2013 (2013), pp.1-11.
https://search.emarefa.net/detail/BIM-461244

نمط استشهاد الجمعية الطبية الأمريكية (AMA)

Zhang, Zhicong& Hu, Kaishun& Li, Shuai& Huang, Huiyu& Zhao, Shaoyong. Chip Attach Scheduling in Semiconductor Assembly. Journal of Industrial Engineering. 2013. Vol. 2013, no. 2013, pp.1-11.
https://search.emarefa.net/detail/BIM-461244

نوع البيانات

مقالات

لغة النص

الإنجليزية

الملاحظات

Includes bibliographical references

رقم السجل

BIM-461244