Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

الملخص EN

Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value.

The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages.

Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the interface delamination.

To this end, a computational model with variable boundary conditions is developed based on the different combination state of water in IC packages.

The distribution characteristics and mechanism of moisture diffusion behavior are analyzed including the humidity distribution field and the relation among baking temperature, water loss rate, and baking time during baking process, and then the results are validated by FEA simulation based on the improved definition of relative moisture concentration.

Baking under variable temperature is proposed and compared with the baking process and baking efficiency under constant temperature to find out the optimized baking parameters.

Finally, a set of curves which indicate the relation between baking energy consumption and temperature are determined under actual industrial baking experiments, which could be used as references to develop industrial standards for PCB disassembling process.