Atomistic Simulation of Intrinsic Defects and Trivalent and Tetravalent Ion Doping in Hydroxyapatite

Joint Authors

Santos, Ricardo D. S.
Rezende, Marcos V. dos S.

Source

Advances in Condensed Matter Physics

Issue

Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-8, 8 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2014-10-12

Country of Publication

Egypt

No. of Pages

8

Main Subjects

Physics

Abstract EN

Atomistic simulation techniques have been employed in order to investigate key issues related to intrinsic defects and a variety of dopants from trivalent and tetravalent ions.

The most favorable intrinsic defect is determined to be a scheme involving calcium and hydroxyl vacancies.

It is found that trivalent ions have an energetic preference for the Ca site, while tetravalent ions can enter P sites.

Charge compensation is predicted to occur basically via three schemes.

In general, the charge compensation via the formation of calcium vacancies is more favorable.

Trivalent dopant ions are more stable than tetravalent dopants.

American Psychological Association (APA)

Santos, Ricardo D. S.& Rezende, Marcos V. dos S.. 2014. Atomistic Simulation of Intrinsic Defects and Trivalent and Tetravalent Ion Doping in Hydroxyapatite. Advances in Condensed Matter Physics،Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1015273

Modern Language Association (MLA)

Santos, Ricardo D. S.& Rezende, Marcos V. dos S.. Atomistic Simulation of Intrinsic Defects and Trivalent and Tetravalent Ion Doping in Hydroxyapatite. Advances in Condensed Matter Physics No. 2014 (2014), pp.1-8.
https://search.emarefa.net/detail/BIM-1015273

American Medical Association (AMA)

Santos, Ricardo D. S.& Rezende, Marcos V. dos S.. Atomistic Simulation of Intrinsic Defects and Trivalent and Tetravalent Ion Doping in Hydroxyapatite. Advances in Condensed Matter Physics. 2014. Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1015273

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-1015273