Research of Joining Brittle Nonmetallic Materials with an Active Solder

Abstract EN

This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite).

However, these materials exert poor wettability when using tin solder.

Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used.

At a soldering temperature of 860°C and 15 min soldering time, the wetting angle on SiO2 ceramics was 30°, on silicon 42°, and on graphite 52°.

All these wetting angles are below 90° and are acceptable for soldering.

It has been shown that the bond in all joined materials (SiO2, Si, and C) was of a diffusion character.

New intermetallic products were formed on the boundary with nonmetal, thus allowing bond formation.

The shear strength of SiO2 ceramics attained an average value of 17 MPa.