Research of Joining Brittle Nonmetallic Materials with an Active Solder
Joint Authors
Source
Advances in Materials Science and Engineering
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-9, 9 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-12-22
Country of Publication
Egypt
No. of Pages
9
Abstract EN
This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite).
However, these materials exert poor wettability when using tin solder.
Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used.
At a soldering temperature of 860°C and 15 min soldering time, the wetting angle on SiO2 ceramics was 30°, on silicon 42°, and on graphite 52°.
All these wetting angles are below 90° and are acceptable for soldering.
It has been shown that the bond in all joined materials (SiO2, Si, and C) was of a diffusion character.
New intermetallic products were formed on the boundary with nonmetal, thus allowing bond formation.
The shear strength of SiO2 ceramics attained an average value of 17 MPa.
American Psychological Association (APA)
Koleňák, Roman& Prach, Michal. 2014. Research of Joining Brittle Nonmetallic Materials with an Active Solder. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-9.
https://search.emarefa.net/detail/BIM-1015839
Modern Language Association (MLA)
Koleňák, Roman& Prach, Michal. Research of Joining Brittle Nonmetallic Materials with an Active Solder. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-9.
https://search.emarefa.net/detail/BIM-1015839
American Medical Association (AMA)
Koleňák, Roman& Prach, Michal. Research of Joining Brittle Nonmetallic Materials with an Active Solder. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-9.
https://search.emarefa.net/detail/BIM-1015839
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1015839