Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites
Joint Authors
Rape, A.
Liu, X.
Kulkarni, A.
Singh, J.
Source
Advances in Materials Science and Engineering
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-12-02
Country of Publication
Egypt
No. of Pages
8
Abstract EN
This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST).
Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase.
Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering.
Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density.
Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity.
American Psychological Association (APA)
Rape, A.& Liu, X.& Kulkarni, A.& Singh, J.. 2014. Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1015880
Modern Language Association (MLA)
Rape, A.…[et al.]. Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-8.
https://search.emarefa.net/detail/BIM-1015880
American Medical Association (AMA)
Rape, A.& Liu, X.& Kulkarni, A.& Singh, J.. Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1015880
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1015880