Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging
Joint Authors
Chang, Che-Jung
Dai, Wen-Li
Chen, Chien-Chih
Li, Der-Chiang
Source
Mathematical Problems in Engineering
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-07-17
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms.
One way to aid in this process is to use a forecasting tool.
However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained.
One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling.
This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process.
The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.
American Psychological Association (APA)
Chang, Che-Jung& Li, Der-Chiang& Dai, Wen-Li& Chen, Chien-Chih. 2013. Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging. Mathematical Problems in Engineering،Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-1031957
Modern Language Association (MLA)
Chang, Che-Jung…[et al.]. Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging. Mathematical Problems in Engineering No. 2013 (2013), pp.1-6.
https://search.emarefa.net/detail/BIM-1031957
American Medical Association (AMA)
Chang, Che-Jung& Li, Der-Chiang& Dai, Wen-Li& Chen, Chien-Chih. Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging. Mathematical Problems in Engineering. 2013. Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-1031957
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1031957