An Analytical Model for Predicting the Stress Distributions within Single-Lap Adhesively Bonded Beams

Joint Authors

He, Xiaocong
Wang, Yuqi

Source

Advances in Materials Science and Engineering

Issue

Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-5, 5 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2014-02-11

Country of Publication

Egypt

No. of Pages

5

Abstract EN

An analytical model for predicting the stress distributions within single-lap adhesively bonded beams under tension is presented in this paper.

By combining the governing equations of each adherend with the joint kinematics, the overall system of governing equations can be obtained.

Both the adherends and the adhesive are assumed to be under plane strain condition.

With suitable boundary conditions, the stress distribution of the adhesive in the longitudinal direction is determined.

American Psychological Association (APA)

He, Xiaocong& Wang, Yuqi. 2014. An Analytical Model for Predicting the Stress Distributions within Single-Lap Adhesively Bonded Beams. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-5.
https://search.emarefa.net/detail/BIM-1034255

Modern Language Association (MLA)

He, Xiaocong& Wang, Yuqi. An Analytical Model for Predicting the Stress Distributions within Single-Lap Adhesively Bonded Beams. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-5.
https://search.emarefa.net/detail/BIM-1034255

American Medical Association (AMA)

He, Xiaocong& Wang, Yuqi. An Analytical Model for Predicting the Stress Distributions within Single-Lap Adhesively Bonded Beams. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-5.
https://search.emarefa.net/detail/BIM-1034255

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-1034255