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Intermetallic Phase on the Interface of Ag-Au-PdAl Structure
Joint Authors
Hsueh, Hao-Wen
Chen, Li-Hui
Lui, Truan-Sheng
Hung, Fei-Yi
Chen, Kuan-Jen
Source
Advances in Materials Science and Engineering
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-03-13
Country of Publication
Egypt
No. of Pages
6
Abstract EN
Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased.
Observations of the Ag-Au-Pd wire after HTS (0–1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC.
A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth.
After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd)2Al with a hexagonal structure.
American Psychological Association (APA)
Hsueh, Hao-Wen& Hung, Fei-Yi& Lui, Truan-Sheng& Chen, Li-Hui& Chen, Kuan-Jen. 2014. Intermetallic Phase on the Interface of Ag-Au-PdAl Structure. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1034324
Modern Language Association (MLA)
Hsueh, Hao-Wen…[et al.]. Intermetallic Phase on the Interface of Ag-Au-PdAl Structure. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-6.
https://search.emarefa.net/detail/BIM-1034324
American Medical Association (AMA)
Hsueh, Hao-Wen& Hung, Fei-Yi& Lui, Truan-Sheng& Chen, Li-Hui& Chen, Kuan-Jen. Intermetallic Phase on the Interface of Ag-Au-PdAl Structure. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1034324
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1034324