Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology

Joint Authors

Li, Yongjiu
Dai, Xiwang
Zhu, Cheng
Huo, Feifei
Dong, Gang
Li, Long

Source

International Journal of Antennas and Propagation

Issue

Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-11, 11 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2014-11-13

Country of Publication

Egypt

No. of Pages

11

Main Subjects

Electronic engineering

Abstract EN

A low profile chip-package stacked-patch antenna is proposed by using low temperature cofired ceramic (LTCC) technology.

The proposed antenna employs a stacked-patch to achieve two operating frequency bands and enhance the bandwidth.

The height of the antenna is decreased to 4.09 mm (about λ /25 at 2.45 GHz) due to the shorted pin.

The package is mounted on a 44 × 44 mm2 ground plane to miniaturize the volume of the system.

The design parameters of the antenna and the effect of the antenna on chip-package cavity are carefully analyzed.

The designed antenna operates at a center frequency of 2.45 GHz and its impedance bandwidth ( S 11 < - 10 d B ) is 200 MHz, resulting from two neighboring resonant frequencies at 2.41 and 2.51 GHz, respectively.

The average gain across the frequency band is about 5.28 dBi.

American Psychological Association (APA)

Li, Yongjiu& Li, Long& Dai, Xiwang& Zhu, Cheng& Huo, Feifei& Dong, Gang. 2014. Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology. International Journal of Antennas and Propagation،Vol. 2014, no. 2014, pp.1-11.
https://search.emarefa.net/detail/BIM-1036013

Modern Language Association (MLA)

Li, Yongjiu…[et al.]. Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology. International Journal of Antennas and Propagation No. 2014 (2014), pp.1-11.
https://search.emarefa.net/detail/BIM-1036013

American Medical Association (AMA)

Li, Yongjiu& Li, Long& Dai, Xiwang& Zhu, Cheng& Huo, Feifei& Dong, Gang. Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology. International Journal of Antennas and Propagation. 2014. Vol. 2014, no. 2014, pp.1-11.
https://search.emarefa.net/detail/BIM-1036013

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-1036013