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Agglomeration and Dendritic Growth of CuTiSi Thin Film
Joint Authors
Lin, Qi-jing
Jing, Weixuan
Yang, Shu-ming
Jiang, Zhuang-de
Wang, Chen-ying
Source
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-01-30
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
Agglomeration and the transformation from random fractal to dendritic growth have been observed during Cu/Ti/Si thin film annealing.
The experimental results show that the annealing temperature, film thickness, and substrate thickness influenced the agglomeration and dendritic growth.
Multifractal spectrum is used to characterize the surface morphology quantificationally.
The shapes of the multifractal spectra are hook-like to the left.
Value of Δ α increases with the annealing temperature rising, and Δ f increases from 500°C to 700°C but reduces from 700°C to 800°C.
The dendritic patterns with symmetrical branches are generated in the surfaces when the thin films were annealed at 800°C.
American Psychological Association (APA)
Lin, Qi-jing& Jing, Weixuan& Yang, Shu-ming& Jiang, Zhuang-de& Wang, Chen-ying. 2014. Agglomeration and Dendritic Growth of CuTiSi Thin Film. Journal of Nanomaterials،Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1041620
Modern Language Association (MLA)
Lin, Qi-jing…[et al.]. Agglomeration and Dendritic Growth of CuTiSi Thin Film. Journal of Nanomaterials No. 2014 (2014), pp.1-8.
https://search.emarefa.net/detail/BIM-1041620
American Medical Association (AMA)
Lin, Qi-jing& Jing, Weixuan& Yang, Shu-ming& Jiang, Zhuang-de& Wang, Chen-ying. Agglomeration and Dendritic Growth of CuTiSi Thin Film. Journal of Nanomaterials. 2014. Vol. 2014, no. 2014, pp.1-8.
https://search.emarefa.net/detail/BIM-1041620
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1041620