Remarks on Residual Stress Measurement by Hole-Drilling and Electronic Speckle Pattern Interferometry
Joint Authors
Pappalettere, C.
Barile, Claudia
Casavola, Caterina
Pappalettera, Giovanni
Source
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-7, 7 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-07-06
Country of Publication
Egypt
No. of Pages
7
Main Subjects
Medicine
Information Technology and Computer Science
Abstract EN
Hole drilling is the most widespread method for measuring residual stress.
It is based on the principle that drilling a hole in the material causes a local stress relaxation; the initial residual stress can be calculated by measuring strain in correspondence with each drill depth.
Recently optical techniques were introduced to measure strain; in this case, the accuracy of the final results depends, among other factors, on the proper choice of the area of analysis.
Deformations are in fact analyzed within an annulus determined by two parameters: the internal and the external radius.
In this paper, the influence of the choice of the area of analysis was analysed.
A known stress field was introduced on a Ti grade 5 sample and then the stress was measured in correspondence with different values of the internal and the external radius of analysis; results were finally compared with the expected theoretical value.
American Psychological Association (APA)
Barile, Claudia& Casavola, Caterina& Pappalettera, Giovanni& Pappalettere, C.. 2014. Remarks on Residual Stress Measurement by Hole-Drilling and Electronic Speckle Pattern Interferometry. The Scientific World Journal،Vol. 2014, no. 2014, pp.1-7.
https://search.emarefa.net/detail/BIM-1049797
Modern Language Association (MLA)
Barile, Claudia…[et al.]. Remarks on Residual Stress Measurement by Hole-Drilling and Electronic Speckle Pattern Interferometry. The Scientific World Journal No. 2014 (2014), pp.1-7.
https://search.emarefa.net/detail/BIM-1049797
American Medical Association (AMA)
Barile, Claudia& Casavola, Caterina& Pappalettera, Giovanni& Pappalettere, C.. Remarks on Residual Stress Measurement by Hole-Drilling and Electronic Speckle Pattern Interferometry. The Scientific World Journal. 2014. Vol. 2014, no. 2014, pp.1-7.
https://search.emarefa.net/detail/BIM-1049797
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1049797