Modeling and Simulation of Network-on-Chip Systems with DEVS and DEUS

Author

Amoretti, Michele

Source

The Scientific World Journal

Issue

Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-9, 9 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2014-04-17

Country of Publication

Egypt

No. of Pages

9

Main Subjects

Medicine
Information Technology and Computer Science

Abstract EN

Networks on-chip (NoCs) provide enhanced performance, scalability, modularity, and design productivity as compared with previous communication architectures for VLSI systems on-chip (SoCs), such as buses and dedicated signal wires.

Since the NoC design space is very large and high dimensional, evaluation methodologies rely heavily on analytical modeling and simulation.

Unfortunately, there is no standard modeling framework.

In this paper we illustrate how to design and evaluate NoCs by integrating the Discrete Event System Specification (DEVS) modeling framework and the simulation environment called DEUS.

The advantage of such an approach is that both DEVS and DEUS support modularity—the former being a sound and complete modeling framework and the latter being an open, general-purpose platform, characterized by a steep learning curve and the possibility to simulate any system at any level of detail.

American Psychological Association (APA)

Amoretti, Michele. 2014. Modeling and Simulation of Network-on-Chip Systems with DEVS and DEUS. The Scientific World Journal،Vol. 2014, no. 2014, pp.1-9.
https://search.emarefa.net/detail/BIM-1051862

Modern Language Association (MLA)

Amoretti, Michele. Modeling and Simulation of Network-on-Chip Systems with DEVS and DEUS. The Scientific World Journal No. 2014 (2014), pp.1-9.
https://search.emarefa.net/detail/BIM-1051862

American Medical Association (AMA)

Amoretti, Michele. Modeling and Simulation of Network-on-Chip Systems with DEVS and DEUS. The Scientific World Journal. 2014. Vol. 2014, no. 2014, pp.1-9.
https://search.emarefa.net/detail/BIM-1051862

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-1051862