Study of Direct Bonding Ceramics with Metal Using Sn2La Solder
Joint Authors
Source
Advances in Materials Science and Engineering
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-13, 13 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-11-22
Country of Publication
Egypt
No. of Pages
13
Abstract EN
The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3 and selected metals, with primary attention given to Cu substrate.
Soldering was performed with Sn-based solder alloyed with 2% La.
We found that the bond formation between Sn2La solder and Al2O3 occurs at the activation of lanthanum phases in solder by ultrasound.
Lanthanum in the solder becomes oxidised in air during the soldering process.
However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material.
A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3 material, ensuring both wetting and joint formation.
The shear strength with Al2O3 ceramics is 7.5 MPa.
Increased strength to 13.5 MPa was observed with SiC ceramics.
American Psychological Association (APA)
Koleňák, Roman& Kostolný, Igor. 2015. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder. Advances in Materials Science and Engineering،Vol. 2015, no. 2015, pp.1-13.
https://search.emarefa.net/detail/BIM-1053145
Modern Language Association (MLA)
Koleňák, Roman& Kostolný, Igor. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder. Advances in Materials Science and Engineering No. 2015 (2015), pp.1-13.
https://search.emarefa.net/detail/BIM-1053145
American Medical Association (AMA)
Koleňák, Roman& Kostolný, Igor. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder. Advances in Materials Science and Engineering. 2015. Vol. 2015, no. 2015, pp.1-13.
https://search.emarefa.net/detail/BIM-1053145
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1053145