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Feasible Time Evolution Model That Predicts Breakdown in Thin SiO2 Films within Unstressed Interval after Constant-Current Stress
Author
Source
Advances in Materials Science and Engineering
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-02-24
Country of Publication
Egypt
No. of Pages
8
Abstract EN
This paper proposes a poststress time evolution model for sub-10-nm thick SiO2 films for degradation prediction and the extraction of trap-related parameters.
The model is based on the understanding that the degradation in thin SiO2 films continues within the unstressed interval.
The phenomenon is captured by an analytical expression that indicates that the time evolution of SiO2 film degradation roughly consists of two stages and that the degradation is more likely to occur if water molecules are present.
It is demonstrated that the simple analytical model successfully reproduces measured results.
It is also suggested that the degradation process considered here is related to oxygen diffusion in the resistive transition process.
American Psychological Association (APA)
Omura, Yasuhisa. 2015. Feasible Time Evolution Model That Predicts Breakdown in Thin SiO2 Films within Unstressed Interval after Constant-Current Stress. Advances in Materials Science and Engineering،Vol. 2015, no. 2015, pp.1-8.
https://search.emarefa.net/detail/BIM-1053719
Modern Language Association (MLA)
Omura, Yasuhisa. Feasible Time Evolution Model That Predicts Breakdown in Thin SiO2 Films within Unstressed Interval after Constant-Current Stress. Advances in Materials Science and Engineering No. 2015 (2015), pp.1-8.
https://search.emarefa.net/detail/BIM-1053719
American Medical Association (AMA)
Omura, Yasuhisa. Feasible Time Evolution Model That Predicts Breakdown in Thin SiO2 Films within Unstressed Interval after Constant-Current Stress. Advances in Materials Science and Engineering. 2015. Vol. 2015, no. 2015, pp.1-8.
https://search.emarefa.net/detail/BIM-1053719
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1053719