Thermomechanical Behaviour of a PWB by Speckle Interferometry Technique
Joint Authors
Trentadue, Bartolomeo
Illuzzi, Giuseppe
Source
Active and Passive Electronic Components
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-08-18
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
The speckle interferometry technique has been used in this work in order to determine the thermomechanical behaviour of Printed Wiring Board (PWB) (circuits) of a radio integrated with tape player and speakers.
A preliminary experiment of such technique has been carried out on a single electronic component (silicon transistor), during the thermal transient and at the steady state.
The thermal deformation and stresses on PWB have been obtained through related experimental analyses on both cases.
The results showed a very good applicability of speckle technique on the irregular object surface as PWB.
American Psychological Association (APA)
Trentadue, Bartolomeo& Illuzzi, Giuseppe. 2015. Thermomechanical Behaviour of a PWB by Speckle Interferometry Technique. Active and Passive Electronic Components،Vol. 2015, no. 2015, pp.1-6.
https://search.emarefa.net/detail/BIM-1053828
Modern Language Association (MLA)
Trentadue, Bartolomeo& Illuzzi, Giuseppe. Thermomechanical Behaviour of a PWB by Speckle Interferometry Technique. Active and Passive Electronic Components No. 2015 (2015), pp.1-6.
https://search.emarefa.net/detail/BIM-1053828
American Medical Association (AMA)
Trentadue, Bartolomeo& Illuzzi, Giuseppe. Thermomechanical Behaviour of a PWB by Speckle Interferometry Technique. Active and Passive Electronic Components. 2015. Vol. 2015, no. 2015, pp.1-6.
https://search.emarefa.net/detail/BIM-1053828
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1053828
