A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages
Author
Source
International Journal of Antennas and Propagation
Issue
Vol. 2016, Issue 2016 (31 Dec. 2016), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2016-03-16
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via.
This design has been proposed for a multilayer substrate package.
The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance.
A physics-based equivalent circuit modeling approach has been employed for this research.
The right angle MS-to-MS via transition was also designed using this technique.
The simulated S -parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction.
The measured S -parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.
American Psychological Association (APA)
Yu, Meng-Xia. 2016. A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages. International Journal of Antennas and Propagation،Vol. 2016, no. 2016, pp.1-8.
https://search.emarefa.net/detail/BIM-1105376
Modern Language Association (MLA)
Yu, Meng-Xia. A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages. International Journal of Antennas and Propagation No. 2016 (2016), pp.1-8.
https://search.emarefa.net/detail/BIM-1105376
American Medical Association (AMA)
Yu, Meng-Xia. A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages. International Journal of Antennas and Propagation. 2016. Vol. 2016, no. 2016, pp.1-8.
https://search.emarefa.net/detail/BIM-1105376
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1105376