Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment

Abstract EN

Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrifuging.

The sintering bonding process using Ag nanoparticle paste at different bonding pressures is studied.

The joint strengths are increased as the bonding pressure increases from 0 MPa to 7.5 MPa.

This is due to the fact that the higher assistant bonding pressure is beneficial to the growth of neck size between the adjacent particles and forms denser sintered Ag layers.

The joint strength bonded under 10 MPa is lower than that bonded under 7.5 MPa, which may be due to the residue of organic component in the sintered Ag layer.

The joint properties bonded with Ag nanoparticle paste in high temperature environment are evaluated by heat treatments at temperatures ranges of 200–350°C for 50 hours.

The results show that the mechanical properties of joint with Ag nanoparticle paste are better than the joint with Pb95Sn5 solder after storage at high temperatures.