Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging

Abstract EN

This paper describes the preparation of low-temperature sintered nanosilver paste with inverse microemulsion method with Span-80/Triton X-100 as the mixed-surfactant and analyzes the influence of different sintering parameters (temperature, pressure) on the shear properties of low-temperature sintering of nanosilver.

Experimental results show that the shear strength of the low-temperature sintering of nanosilver increases as the temperature and pressure increase.

But there are many pores and relative fewer cracks on the sintering layer after low-temperature sintered.

The test thermal resistance of low-temperature sintered nanosilver paste is 0.795 K/W which is greater than SAC305 weld layer with a T3ster thermal analyzer.

The adhesive performance and the heat dispersion of low-temperature sintered nanosilver paste need to be further researched and improved.