Molecular Dynamics Simulation of Nanoindentation of CuAu Thin Films at Different Temperatures
Joint Authors
Liang, Yunpei
Li, Qibin
Huang, Cheng
Fu, Tao
Peng, Tiefeng
Source
Issue
Vol. 2016, Issue 2016 (31 Dec. 2016), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2016-11-13
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
Two methods, deposition method and ideal modeling based on lattice constant, are used to prepare three modulation periods’ (1.8 nm Cu/3.6 nm Au, 2.7 nm Cu/2.7 nm Au, and 3.6 nm Cu/1.8 nm Au) thin films for nanoindentation at different temperatures.
The results show that the temperature will weaken the hardness of thin films.
The deposition method and the formation of coherent interface will result in a lot of defects in thin films.
These defects can reduce the residual stress in the thin films which is caused by the external force.
The proposed system will provide potential benefits in designing the microstructures for thin films.
American Psychological Association (APA)
Li, Qibin& Huang, Cheng& Liang, Yunpei& Fu, Tao& Peng, Tiefeng. 2016. Molecular Dynamics Simulation of Nanoindentation of CuAu Thin Films at Different Temperatures. Journal of Nanomaterials،Vol. 2016, no. 2016, pp.1-8.
https://search.emarefa.net/detail/BIM-1109495
Modern Language Association (MLA)
Li, Qibin…[et al.]. Molecular Dynamics Simulation of Nanoindentation of CuAu Thin Films at Different Temperatures. Journal of Nanomaterials No. 2016 (2016), pp.1-8.
https://search.emarefa.net/detail/BIM-1109495
American Medical Association (AMA)
Li, Qibin& Huang, Cheng& Liang, Yunpei& Fu, Tao& Peng, Tiefeng. Molecular Dynamics Simulation of Nanoindentation of CuAu Thin Films at Different Temperatures. Journal of Nanomaterials. 2016. Vol. 2016, no. 2016, pp.1-8.
https://search.emarefa.net/detail/BIM-1109495
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1109495