Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive
Joint Authors
Go, Shin-Il
Li, Yinsheng
Ko, Jae-Woong
Kim, Ha-Neul
Kwon, Se-Hun
Kim, Hai-Doo
Park, Young-Jo
Source
Advances in Materials Science and Engineering
Issue
Vol. 2018, Issue 2018 (31 Dec. 2018), pp.1-5, 5 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2018-09-05
Country of Publication
Egypt
No. of Pages
5
Abstract EN
The particle size effect of MgO as a sintering additive on the thermal conductivity of sintered reaction-bonded silicon nitride (SRBSN) was investigated.
It was revealed that the size of MgO is critical for thermal conductivity with regard to the microstructural evolution process.
That is, the abnormal grain growth promoted by an inhomogeneous liquid-phase distribution led to higher thermal conductivity when coarser MgO was added, whereas a relatively homogeneous liquid-phase distribution induced moderate grain growth and lower thermal conductivity when finer MgO was added.
American Psychological Association (APA)
Go, Shin-Il& Li, Yinsheng& Ko, Jae-Woong& Kim, Ha-Neul& Kwon, Se-Hun& Kim, Hai-Doo…[et al.]. 2018. Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive. Advances in Materials Science and Engineering،Vol. 2018, no. 2018, pp.1-5.
https://search.emarefa.net/detail/BIM-1120698
Modern Language Association (MLA)
Go, Shin-Il…[et al.]. Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive. Advances in Materials Science and Engineering No. 2018 (2018), pp.1-5.
https://search.emarefa.net/detail/BIM-1120698
American Medical Association (AMA)
Go, Shin-Il& Li, Yinsheng& Ko, Jae-Woong& Kim, Ha-Neul& Kwon, Se-Hun& Kim, Hai-Doo…[et al.]. Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive. Advances in Materials Science and Engineering. 2018. Vol. 2018, no. 2018, pp.1-5.
https://search.emarefa.net/detail/BIM-1120698
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1120698