Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging
Joint Authors
He, Piaopiao
Zhang, Jinlong
Zhang, Jianhua
Yin, Luqiao
Source
Advances in Materials Science and Engineering
Issue
Vol. 2017, Issue 2017 (31 Dec. 2017), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2017-01-22
Country of Publication
Egypt
No. of Pages
8
Abstract EN
The reliability of high-power light-emitting-diode (LED) devices strongly depends on the die-attach quality because voids may increase junction temperature and total thermal resistance of LED devices.
Die-attach material has a key role in the thermal management of high-power LED package by providing low-contact thermal resistance.
Thermal and mechanical analyses were carried out by experiments and thermal simulation.
The quantitative analysis results show that thermal resistance of die-attach layer (thermal resistance caused by die-attach material and voids in die-attach layer) plays an important role in total thermal resistance of high-power LED packaging according to the differential structure function of thermal transient characteristics.
The increase of void fraction in die-attach layer causes the increases of thermal resistance of die-attach layer; the thermal resistance increased by 1.95 K/W when the void fraction increased to 62.45%.
The voids also make an obvious influence on thermal stress and thermal strain of chip; the biggest thermal stress of chip was as high as 847.1 MPa compared to the 565.2 MPa when the void fraction increases from being void-free to 30% in the die-attach layer.
American Psychological Association (APA)
He, Piaopiao& Zhang, Jinlong& Zhang, Jianhua& Yin, Luqiao. 2017. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Advances in Materials Science and Engineering،Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1124938
Modern Language Association (MLA)
He, Piaopiao…[et al.]. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Advances in Materials Science and Engineering No. 2017 (2017), pp.1-8.
https://search.emarefa.net/detail/BIM-1124938
American Medical Association (AMA)
He, Piaopiao& Zhang, Jinlong& Zhang, Jianhua& Yin, Luqiao. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Advances in Materials Science and Engineering. 2017. Vol. 2017, no. 2017, pp.1-8.
https://search.emarefa.net/detail/BIM-1124938
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1124938