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Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
Joint Authors
Xue, Songbai
Xu, Jiachen
Wu, Mingfang
Pu, Juan
Source
Advances in Materials Science and Engineering
Issue
Vol. 2020, Issue 2020 (31 Dec. 2020), pp.1-16, 16 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2020-05-26
Country of Publication
Egypt
No. of Pages
16
Abstract EN
With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied.
Hence, greater demands are being placed on electronic packaging materials.
High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity.
Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently.
But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear.
In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed.
Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.
American Psychological Association (APA)
Xu, Jiachen& Wu, Mingfang& Pu, Juan& Xue, Songbai. 2020. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Advances in Materials Science and Engineering،Vol. 2020, no. 2020, pp.1-16.
https://search.emarefa.net/detail/BIM-1128486
Modern Language Association (MLA)
Xu, Jiachen…[et al.]. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Advances in Materials Science and Engineering No. 2020 (2020), pp.1-16.
https://search.emarefa.net/detail/BIM-1128486
American Medical Association (AMA)
Xu, Jiachen& Wu, Mingfang& Pu, Juan& Xue, Songbai. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Advances in Materials Science and Engineering. 2020. Vol. 2020, no. 2020, pp.1-16.
https://search.emarefa.net/detail/BIM-1128486
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1128486