Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane
Joint Authors
Li, Xianjun
Fan, Youhua
Deng, Layun
Wang, Yong
Lou, Wanli
Source
International Journal of Polymer Science
Issue
Vol. 2019, Issue 2019 (31 Dec. 2019), pp.1-7, 7 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2019-01-31
Country of Publication
Egypt
No. of Pages
7
Main Subjects
Abstract EN
In this paper, thermogravimetric (TG) analysis was carried out to make clear the curing properties of soy flour-based adhesives (SFAs) enhanced by waterborne polyurethane (WPU) with different addition levels.
The kinetic parameters were evaluated by a thermal dynamics method, including activation energy and preexponential factor.
In addition, the structure characteristics of both soy flour and modified soy flour-based adhesives were tested by Fourier transform infrared spectroscopy (FTIR).
The results revealed that the FTIR spectra of pristine soy flour-based adhesives were different from those of soy flour after alkali treatment and waterborne polyurethane modification.
Furthermore, there were four main degradation phases in the derivative thermogravimetric (DTG) curves of modified soy-based adhesives while there were two phases of a defatted soy flour sample.
The kinetics analysis demonstrated that the curing process could be described as a consecutive first-order curing process.
Moreover, with the addition level of WPU growing, the apparent activation energy of each phase of the curing process was increasing compared with that in pristine soy-based adhesives.
American Psychological Association (APA)
Wang, Yong& Li, Xianjun& Lou, Wanli& Deng, Layun& Fan, Youhua. 2019. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. International Journal of Polymer Science،Vol. 2019, no. 2019, pp.1-7.
https://search.emarefa.net/detail/BIM-1167857
Modern Language Association (MLA)
Wang, Yong…[et al.]. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. International Journal of Polymer Science No. 2019 (2019), pp.1-7.
https://search.emarefa.net/detail/BIM-1167857
American Medical Association (AMA)
Wang, Yong& Li, Xianjun& Lou, Wanli& Deng, Layun& Fan, Youhua. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. International Journal of Polymer Science. 2019. Vol. 2019, no. 2019, pp.1-7.
https://search.emarefa.net/detail/BIM-1167857
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1167857