Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution
Joint Authors
Guerrero, Jan-Ervin C.
Camacho, Drexel H.
Mokhtari, Omid
Nishikawa, Hiroshi
Source
International Journal of Corrosion
Issue
Vol. 2018, Issue 2018 (31 Dec. 2018), pp.1-11, 11 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2018-05-02
Country of Publication
Egypt
No. of Pages
11
Main Subjects
Abstract EN
The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein.
Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate.
Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has slight decrease attributed to the formation of thin passivation film after 15 days.
The leaching amounts of Sn are observed to be higher in solder joint than in solder alloy due to the galvanic corrosion happening on the surface.
EDS and XRD results of the corroded surface confirm that the corroded product is made up of oxides of tin.
American Psychological Association (APA)
Guerrero, Jan-Ervin C.& Camacho, Drexel H.& Mokhtari, Omid& Nishikawa, Hiroshi. 2018. Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution. International Journal of Corrosion،Vol. 2018, no. 2018, pp.1-11.
https://search.emarefa.net/detail/BIM-1169878
Modern Language Association (MLA)
Guerrero, Jan-Ervin C.…[et al.]. Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution. International Journal of Corrosion No. 2018 (2018), pp.1-11.
https://search.emarefa.net/detail/BIM-1169878
American Medical Association (AMA)
Guerrero, Jan-Ervin C.& Camacho, Drexel H.& Mokhtari, Omid& Nishikawa, Hiroshi. Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution. International Journal of Corrosion. 2018. Vol. 2018, no. 2018, pp.1-11.
https://search.emarefa.net/detail/BIM-1169878
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1169878
