Study on Properties of Heat-Resistant Hybrid Resin Containing Silicon and Composites

Abstract EN

In recent years, one kind of novel hybrid polymer containing silicon has already been reported in the field of high-temperature resistance polymer.

Gradually, it has been a research hotspot in the field of high-performance matrix resins because of excellent heat resistance and dielectric properties.

The composite was prepared by M-aminophenylacetylene terminated polymethyldiphenylethynyl silane (MDPES-2) as a matrix and nonalkali glass cloth as reinforced material using a hot press process.

The cure reaction of MDPES-2 was characterized.

Meanwhile, heat resistance, mechanical properties, and dielectric properties of MDPES-2 composites were systematically studied in this paper.

The results showed that flexural strength at room temperature is 321 MPa and flexural strength retention at 240°C was 98.3%.

Flexural strength retention after thermal treatment at 500°C for 7 min was 84%.

In addition, ε and dielectric dissipation factor (tanδ) were 3.9 and 2.0×10−3 (10 GHz).