Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

Abstract EN

A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique.

The results indicated that the glass transition temperature (Tg) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions.

ODPA-TPER-based polyimide possesses the lowest Tg, which was 214°C.

All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (Tm) at 316°C.

The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.