Effect of Zn addition on alloy by 0.3, 0.6 and 0.9 wt.% on thermal properties, electrical conductivity and microstructure of eutectic Sn-3.5Ag alloy

Abstract EN

In this work, the effects of 0.3, 0.6 and 0.9 wt.% Zn additives on the characteristic of Sn3.5Ag eutectic solder alloy, have been diluted to produce four micro alloys.

Effects of 0.3 to 0.9 wt% Zn- additions on phase transformation and electrical resistivity of Sn-3.5Ag eutectic solder alloy have been investigated using Differential Scanning Calorimetry (DSC) and Keithley Source Meter (SMU), respectively.

The addition of Zn reduced the melting point of the eutectic Sn–3.5Ag alloy and the pasty range (Tend - Tonset) for the Sn-3.5Ag-0.3Zn, Sn-3.5Ag-0.6Zn and Sn-3.5Ag- 0.9Zn solder alloys are 8.34, 8.31 and 7.12 °C respectively, decreased from four micro alloys 8.34 °C to 7.12 °C.

These results show that the Zn addition is beneficial to decrease the heat of fusion of the Sn-3.5Ag solder alloy This improvement is an indication for property enhancing the mechanical properties.

It is showing that the solder alloy needs the lowest energy for melting and it is a useful for saving energy also the resistivity increases continuously with Zn content.