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The effect of bath temperature on the chemical bath deposition of copper sulphide thin films
Joint Authors
Qasim, Anwar
Tee, Tan Wee
Nagalingam, Saravanan
Min, Ho Soon
Source
Issue
Vol. 5, Issue 2 (30 Jun. 2010), pp.165-173, 9 p.
Publisher
Yarmouk University Deanship of Research and Graduate Studies
Publication Date
2010-06-30
Country of Publication
Jordan
No. of Pages
9
Main Subjects
Topics
Abstract EN
Copper supplied thin films were deposited onto indium tin oxide glass substrates by chemical bath deposition technique.
The chemical bath contained copper chloride and sodium thiosulfate acted as Cu2+ and S2- ion sources, respectively.
The influence of bath temperature towards the properties of copper supplied films was investigated.
The deposited films were characterized with X-ray diffraction, atomic force microscopy and UV-Vis spectrophotometer.
XRD studies demonstrated that the thin films had hexagonal structure and confirmed the improvement of crystallinity of the films by increasing the bath temperature.
Meanwhile, the surface roughness, film thickness and grain size were also increased with increasing of bath temperature from 25 to 45 °C.
However, the films deposited at 25 °C showed homogeneous and uniform structure according to AFM images.
Optical absorption analysis indicated that the band gap values were increased from 2.5 to 2.7 eV as the bath temperature was decreased from45 to 25 °C.
The XRD, AFM and optical absorption analysis results suggested that the influence of bath temperature on the CuS thin films properties was significant.
Therefore, the bath temperature was one of the main deposition parameters that control the properties of semiconductor thin films.
American Psychological Association (APA)
Qasim, Anwar& Tee, Tan Wee& Nagalingam, Saravanan& Min, Ho Soon. 2010. The effect of bath temperature on the chemical bath deposition of copper sulphide thin films. Jordan Journal of Chemistry،Vol. 5, no. 2, pp.165-173.
https://search.emarefa.net/detail/BIM-266309
Modern Language Association (MLA)
Qasim, Anwar…[et al.]. The effect of bath temperature on the chemical bath deposition of copper sulphide thin films. Jordan Journal of Chemistry Vol. 5, no. 2 (Jun. 2010), pp.165-173.
https://search.emarefa.net/detail/BIM-266309
American Medical Association (AMA)
Qasim, Anwar& Tee, Tan Wee& Nagalingam, Saravanan& Min, Ho Soon. The effect of bath temperature on the chemical bath deposition of copper sulphide thin films. Jordan Journal of Chemistry. 2010. Vol. 5, no. 2, pp.165-173.
https://search.emarefa.net/detail/BIM-266309
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references : p. 173
Record ID
BIM-266309