Modeling and simulation of electropating process

Abstract EN

In this study, it is acquainted with the kinetics of the chemical and electrochemical reactions by modeling and understanding of the essential and secondary (conjugate) chemical electrochemical reactions during plating process.

In addition, the effects of various conditions on the speed and kinetic of those reactions is also considered.

In order to apply this manner, the mean-field kinetic equations and Poisson equation for charged lattice model are adopted using two types of one-dimensional cells for theoretical part of this study , namely (half and full cell) of size (100) with an applied potential of ( 2 KT/ e ) .

Provided that the cell should contain two identical electrodes of thickness (10) .A computer program in visual basic is specially constructed to show the results of this study as it should be.

Through this program the concentrations are determined including (metallic atoms, cations, anions, solvents, vacancies and electrons), the charges distribution and electrical potential across the sites.

The results, during the three periods (5t = (1, 3, 5) 105, showed that under potential application across the cell, the deposition continues for long time then it is suppressed when the anode reaches failure limit, and it is observed that the deposition increases with the extension of space charges at the cathode, from the other hand, the ionic evolution (cation) will take a peak shape at the cathode, then it has a certain gradient between anode and cathode.

A reversed situation occurs for the anions evolution.

At the same time, electric potential distribution across the sites becomes higher resulting in deposition increasing.