Experimental study to show the effect of copper and nickel additions on thermal properties of pure aluminum use normal probability plot

Abstract EN

In this research, an experimental work has been conducted to show the effect of adding of copper (Cu) and nickel (Ni) on the thermal properties of pure aluminum (AL) which were density of alloy, specific heat at constant volume (Cv), thermal conductivity (k) and thermal diffusivity.

Ten alloys have been prepared by changing percentages addition of copper and nickel to pure aluminum and the percentages are (5, 10, 15, 20 & 25 %).

The effect of an average deviation and variability on the thermal properties after an addition of copper and nickel through use of normal probability plot.

The results shows as that copper addition percentage is increased lead to, increasing the alloy density by (57.7 %), the thermal conductivity by (15.78 %), decreasing the specific heat by (14.3 %) and thermal diffusivity by (14.4 %).

Also as the nickel addition percentage is increased cause, increasing the alloy density by (67.3 %), and decreasing the thermal conductivity by (18.6 %), the specific heat by (11.8%) and the thermal diffusivity by (44.8 %).

Through this study it was found that the best addition is 25 % (Cu) addition percentage for pure aluminum, gives highest thermal properties (Cv, k) compared with the same addition percentage of nickel .

The greater average of deviation was the property of the specific heat when adding nickel and the greater variability was the property of the thermal conductivity when adding nickel.