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Investigation of heat transfer phenomena and flow behavior around electronic chip
Other Title(s)
بحث ظاهرة انتقال الحرارة و تصرف الجريان حول جزء إلكتروني
Author
Source
al-Khwarizmi Engineering Journal
Issue
Vol. 3, Issue 2 (31 Aug. 2007), pp.17-31, 15 p.
Publisher
University of Baghdad al-Khwarizmi College of Engineering
Publication Date
2007-08-31
Country of Publication
Iraq
No. of Pages
15
Main Subjects
Abstract EN
Computational study of three-dimensional laminar and turbulent flows around electronic chip (heat source) located on a printed circuit board are presented.
Computational field involves the solution of elliptic partial differential equations for conservation of mass, momentum, energy, turbulent energy, and its dissipation rate in finite volume form.
The k-ε turbulent model was used with the wall function concept near the walls to treat of turbulence effects.
The SIMPLE algorithm was selected in this work.
The chip is cooled by an external flow of air.
The goals of this investigation are to investigate the heat transfer phenomena of electronic chip located in enclosure and how we arrive to optimum level for cooling of this chip.
These parameters, which will help enhance thermal performance of electronic chip and flow patterns, through the understanding of different factors on flow patterns.
The results show the relation between the temperature rise, heat transfer parameters (Nu, Ra) with (Ar, Q) for two cases of laminar and turbulent flows.
American Psychological Association (APA)
Habib, Sattar Jabir. 2007. Investigation of heat transfer phenomena and flow behavior around electronic chip. al-Khwarizmi Engineering Journal،Vol. 3, no. 2, pp.17-31.
https://search.emarefa.net/detail/BIM-340187
Modern Language Association (MLA)
Habib, Sattar Jabir. Investigation of heat transfer phenomena and flow behavior around electronic chip. al-Khwarizmi Engineering Journal Vol. 3, no. 2 (2007), pp.17-31.
https://search.emarefa.net/detail/BIM-340187
American Medical Association (AMA)
Habib, Sattar Jabir. Investigation of heat transfer phenomena and flow behavior around electronic chip. al-Khwarizmi Engineering Journal. 2007. Vol. 3, no. 2, pp.17-31.
https://search.emarefa.net/detail/BIM-340187
Data Type
Journal Articles
Language
English
Notes
Includes appendix : p. 29-30
Record ID
BIM-340187