Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection

Joint Authors

Lee, In-Cheol
Nguyen, Khac-Duy
Kim, Jeong-Tae
Hong, Dong-Soo

Source

International Journal of Distributed Sensor Networks

Issue

Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-12, 12 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2012-10-03

Country of Publication

Egypt

No. of Pages

12

Main Subjects

Electronic engineering
Information Technology and Computer Science

Topics

Abstract EN

Temperature-compensated damage monitoring in steel girder connections by using wireless acceleration-impedance sensor nodes is experimentally examined.

To achieve the objective, the following approaches are implemented.

Firstly, wireless acceleration-impedance sensor nodes are described on the design of hardware components to operate.

Secondly, temperature-compensated damage monitoring scheme for steel girder connections is designed by using the temperature compensation model and acceleration-impedance-based structural health monitoring methods.

Finally, the feasibility of temperature-compensated damage monitoring scheme by using wireless acceleration-impedance sensor nodes is experimentally evaluated from damage monitoring in a lab-scaled steel girder with bolted connection joints.

American Psychological Association (APA)

Hong, Dong-Soo& Nguyen, Khac-Duy& Lee, In-Cheol& Kim, Jeong-Tae. 2012. Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection. International Journal of Distributed Sensor Networks،Vol. 2012, no. 2012, pp.1-12.
https://search.emarefa.net/detail/BIM-451190

Modern Language Association (MLA)

Hong, Dong-Soo…[et al.]. Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection. International Journal of Distributed Sensor Networks No. 2012 (2012), pp.1-12.
https://search.emarefa.net/detail/BIM-451190

American Medical Association (AMA)

Hong, Dong-Soo& Nguyen, Khac-Duy& Lee, In-Cheol& Kim, Jeong-Tae. Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection. International Journal of Distributed Sensor Networks. 2012. Vol. 2012, no. 2012, pp.1-12.
https://search.emarefa.net/detail/BIM-451190

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-451190