Temperature Rise during Primer, Adhesive, and Composite Resin Photopolymerization of a Low-Shrinkage Composite Resin under Caries-Like Dentin Lesions

Abstract EN

Objective.

This study evaluated temperature rise of low-shrinkage (LS) self-etch primer (P), LS self-etch adhesive (A), and P90 silorane-based composite resin systems, photopolymerized under normal and artificially demineralized dentin.

Methods.

Forty 1.5 mm-thick dentin discs were prepared from sound human molars, half of which were demineralized.

Temperature rise was measured during photopolymerization using a K-type thermocouple under the discs: 10 s and 40 s irradiation of the discs (controls/groups 1 and 2); 10 s irradiation of primer (P), 10 s irradiation of adhesive (A), 40 s irradiation of P90 without P and A, and 40 s irradiation of P90 with P and A (groups 3 to 6, resp.).

The samples were photopolymerized using an LED unit under 550 mW/cm2 light intensity.

Data was analyzed using repeated measures ANOVA and paired-sample t-test (α=0.05).

Results.

There were no significant differences in temperature rise means between the two dentin samples for each irradiation duration (P>0.0001), with significant differences between the two irradiation durations (P>0.0001).

Temperature rise measured with 40 s irradiation was significantly higher than that of 10 s duration for undemineralized and demineralized dentin P<0.0001).

Conclusions.

Light polymerization of P90 low-shrinkage composite resin resulted in temperature rise approaching threshold value under artificially demineralized and undemineralized dentin.