![](/images/graphics-bg.png)
Toward 3D Integration of 1D Conductors : Junctions of InAs Nanowires
Joint Authors
Linke, Heiner
Samuelson, Lars
Wu, Phillip M.
Source
Issue
Vol. 2011, Issue 2011 (31 Dec. 2011), pp.1-5, 5 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2011-10-25
Country of Publication
Egypt
No. of Pages
5
Main Subjects
Engineering Sciences and Information Technology
Chemistry
Civil Engineering
Abstract EN
A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks.
Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies.
We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires.
The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire planar or 3D electronic devices.
American Psychological Association (APA)
Wu, Phillip M.& Samuelson, Lars& Linke, Heiner. 2011. Toward 3D Integration of 1D Conductors : Junctions of InAs Nanowires. Journal of Nanomaterials،Vol. 2011, no. 2011, pp.1-5.
https://search.emarefa.net/detail/BIM-458898
Modern Language Association (MLA)
Wu, Phillip M.…[et al.]. Toward 3D Integration of 1D Conductors : Junctions of InAs Nanowires. Journal of Nanomaterials No. 2011 (2011), pp.1-5.
https://search.emarefa.net/detail/BIM-458898
American Medical Association (AMA)
Wu, Phillip M.& Samuelson, Lars& Linke, Heiner. Toward 3D Integration of 1D Conductors : Junctions of InAs Nanowires. Journal of Nanomaterials. 2011. Vol. 2011, no. 2011, pp.1-5.
https://search.emarefa.net/detail/BIM-458898
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-458898