Electrical Properties of Amorphous Titanium Oxide Thin Films for Bolometric Application
Joint Authors
Ju, Yongfeng
Wang, Mahua
Fu, Chengfang
Wang, Shihu
Wang, Yunlong
Source
Advances in Condensed Matter Physics
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-5, 5 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-11-30
Country of Publication
Egypt
No. of Pages
5
Main Subjects
Abstract EN
We report the electrical conduction mechanism of amorphous titanium oxide thin films applied for bolometers.
As the O/Ti ratio varies from 1.73 to 1.97 measured by rutherford backscattering spectroscopy, the resistivity of the films increases from 0.26 Ω cm to 10.1 Ω cm.
At the same time, the temperature coefficient of resistivity and activation energy vary from −1.2% to −2.3% and from 0.09 eV to 0.18 eV, respectively.
The temperature dependence of the electrical conductivity illustrates a thermally activated conduction behavior and the carrier transport mechanism in the titanium oxide thin films is found to obey the normal Meyer-Neldel Rule in the temperature range from 293 K to 373 K.
American Psychological Association (APA)
Ju, Yongfeng& Wang, Mahua& Wang, Yunlong& Wang, Shihu& Fu, Chengfang. 2013. Electrical Properties of Amorphous Titanium Oxide Thin Films for Bolometric Application. Advances in Condensed Matter Physics،Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-466264
Modern Language Association (MLA)
Ju, Yongfeng…[et al.]. Electrical Properties of Amorphous Titanium Oxide Thin Films for Bolometric Application. Advances in Condensed Matter Physics No. 2013 (2013), pp.1-5.
https://search.emarefa.net/detail/BIM-466264
American Medical Association (AMA)
Ju, Yongfeng& Wang, Mahua& Wang, Yunlong& Wang, Shihu& Fu, Chengfang. Electrical Properties of Amorphous Titanium Oxide Thin Films for Bolometric Application. Advances in Condensed Matter Physics. 2013. Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-466264
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-466264