Field-Assisted and Thermionic Contributions to Conductance in SnO2 Thick-Films

Joint Authors

Carotta, M. C.
Martinelli, G.
Malagú , C.
Ponce, M. A.
Castro, M. S.
Aldao, C. M.

Source

Journal of Sensors

Issue

Vol. 2009, Issue 2009 (31 Dec. 2009), pp.1-5, 5 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2009-08-30

Country of Publication

Egypt

No. of Pages

5

Main Subjects

Civil Engineering

Abstract EN

A deep analysis of conductance in nanostructured SnO2 thick films has been performed.

A model for field-assisted thermionic barrier crossing is being proposed to explain the film conductivity.

The model has been applied to explain the behavior of resistance in vacuum of two sets of nanostructured thick-films with grains having two well-distinct characteristic radii (R=25 nm and R=125 nm).

In the first case the grain radius is shorter than the depletion region width, a limit at which overlapping of barriers takes place, and in the second case it is longer.

The behavior of resistance in the presence of dry air has been explained through the mechanism of barrier modulation through gas chemisorption.

American Psychological Association (APA)

Malagú , C.& Carotta, M. C.& Martinelli, G.& Ponce, M. A.& Castro, M. S.& Aldao, C. M.. 2009. Field-Assisted and Thermionic Contributions to Conductance in SnO2 Thick-Films. Journal of Sensors،Vol. 2009, no. 2009, pp.1-5.
https://search.emarefa.net/detail/BIM-469208

Modern Language Association (MLA)

Malagú , C.…[et al.]. Field-Assisted and Thermionic Contributions to Conductance in SnO2 Thick-Films. Journal of Sensors No. 2009 (2009), pp.1-5.
https://search.emarefa.net/detail/BIM-469208

American Medical Association (AMA)

Malagú , C.& Carotta, M. C.& Martinelli, G.& Ponce, M. A.& Castro, M. S.& Aldao, C. M.. Field-Assisted and Thermionic Contributions to Conductance in SnO2 Thick-Films. Journal of Sensors. 2009. Vol. 2009, no. 2009, pp.1-5.
https://search.emarefa.net/detail/BIM-469208

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-469208