Structural Health Monitoring Using High-Frequency Electromechanical Impedance Signatures

Joint Authors

Yan, Wei
Chen, W. Q.

Source

Advances in Civil Engineering

Issue

Vol. 2010, Issue 2010 (31 Dec. 2010), pp.1-11, 11 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2010-03-07

Country of Publication

Egypt

No. of Pages

11

Main Subjects

Civil Engineering

Abstract EN

An overview of recent advances in electromechanical impedance- (EMI-) based structural health monitoring is presented in this paper.

The basic principle of the EMI method is to use high-frequency excitation to sense the local area of a structure.

Changes in impedance indicate changes in the structure, which in turn indicate that damages appear.

An accurate EMI model based on the method of reverberation-ray matrix is introduced to correlate changes in the signatures to physical parameters of structures for damage detection.

Comparison with other numerical results and experimental data validates the present model.

A brief remark of the feasibility of implementing the EMI method is considered and the effects of some physical parameters on EMI technique are also discussed.

American Psychological Association (APA)

Yan, Wei& Chen, W. Q.. 2010. Structural Health Monitoring Using High-Frequency Electromechanical Impedance Signatures. Advances in Civil Engineering،Vol. 2010, no. 2010, pp.1-11.
https://search.emarefa.net/detail/BIM-471549

Modern Language Association (MLA)

Yan, Wei& Chen, W. Q.. Structural Health Monitoring Using High-Frequency Electromechanical Impedance Signatures. Advances in Civil Engineering No. 2010 (2010), pp.1-11.
https://search.emarefa.net/detail/BIM-471549

American Medical Association (AMA)

Yan, Wei& Chen, W. Q.. Structural Health Monitoring Using High-Frequency Electromechanical Impedance Signatures. Advances in Civil Engineering. 2010. Vol. 2010, no. 2010, pp.1-11.
https://search.emarefa.net/detail/BIM-471549

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-471549