To Enhance Light Extraction for Organic Light-Emitting Diodes by Body Modification of Substrate

Joint Authors

Wang, Jun
Wang, Chong
Jiang, Yadong

Source

International Journal of Photoenergy

Issue

Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-8, 8 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2013-12-25

Country of Publication

Egypt

No. of Pages

8

Main Subjects

Chemistry

Abstract EN

A facile approach of body modification on substrate is introduced to enhance the light extraction for organic devices.

The lateral metal reflective film (LMRF) was coated on side of substrate and microlens array (MLA) was fabricated on forward surface of substrate.

The two methods of improving light output are simulated and optimized to form body modification.

The metal thin film was evaporated on the side of reversal trapezoid shape substrate to form LMRF layer and the MLA with semicircle shape was fabricated on the substrate using normal photolithography process.

The external quantum efficiency of fabricated organic device with body modification is ~1.8 times higher than the device with normal substrate.

American Psychological Association (APA)

Wang, Jun& Wang, Chong& Jiang, Yadong. 2013. To Enhance Light Extraction for Organic Light-Emitting Diodes by Body Modification of Substrate. International Journal of Photoenergy،Vol. 2013, no. 2013, pp.1-8.
https://search.emarefa.net/detail/BIM-488148

Modern Language Association (MLA)

Wang, Jun…[et al.]. To Enhance Light Extraction for Organic Light-Emitting Diodes by Body Modification of Substrate. International Journal of Photoenergy No. 2013 (2013), pp.1-8.
https://search.emarefa.net/detail/BIM-488148

American Medical Association (AMA)

Wang, Jun& Wang, Chong& Jiang, Yadong. To Enhance Light Extraction for Organic Light-Emitting Diodes by Body Modification of Substrate. International Journal of Photoenergy. 2013. Vol. 2013, no. 2013, pp.1-8.
https://search.emarefa.net/detail/BIM-488148

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-488148