![](/images/graphics-bg.png)
Experimental Studies of Sealing Mechanism of a Dismountable Microsystem-to-Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature
Joint Authors
Bejhed, Johan
Nguyen, Hugo
Thornell, Greger
Source
Advances in Mechanical Engineering
Issue
Vol. 2010, Issue 2010 (31 Dec. 2010), pp.1-11, 11 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2010-05-13
Country of Publication
Egypt
No. of Pages
11
Main Subjects
Abstract EN
As fluidic microelectromechanical devices are developing and often attached to, or embedded in, large, complex, and expensive systems, the issues of modularity, maintenance, and subsystem replacement arise.
In this work, a robust silicon connector suitable for high-pressure applications—likely with harsh fluids—in the temperature range of +100 to −100°C is demonstrated and tested together with a stainless steel nipple representing a simple and typical macropart.
With a micromachined circular membrane equipped with a 5 μm high ridge, this connector is able to maintain a leak rate below 2.0×10−8 scc/s of gaseous helium with a pressure of up to 9.7 bar.
Degradation of the sealing performance on reassembly is associated with the indentation of the ridge.
However, the ridge makes the sealing interface less sensitive to particles in comparison with a flat reference.
Most evaluation is made through the so-called heat-until-leak tests conducted to determine the maximum working temperature and the sealing mechanism of the connector.
A couple of these are followed by cryogenic testing.
The effect of thermal mismatch of the components is discussed and utilized as an early warning mechanism.
American Psychological Association (APA)
Nguyen, Hugo& Bejhed, Johan& Thornell, Greger. 2010. Experimental Studies of Sealing Mechanism of a Dismountable Microsystem-to-Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature. Advances in Mechanical Engineering،Vol. 2010, no. 2010, pp.1-11.
https://search.emarefa.net/detail/BIM-492546
Modern Language Association (MLA)
Nguyen, Hugo…[et al.]. Experimental Studies of Sealing Mechanism of a Dismountable Microsystem-to-Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature. Advances in Mechanical Engineering No. 2010 (2010), pp.1-11.
https://search.emarefa.net/detail/BIM-492546
American Medical Association (AMA)
Nguyen, Hugo& Bejhed, Johan& Thornell, Greger. Experimental Studies of Sealing Mechanism of a Dismountable Microsystem-to-Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature. Advances in Mechanical Engineering. 2010. Vol. 2010, no. 2010, pp.1-11.
https://search.emarefa.net/detail/BIM-492546
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-492546